Ebipande bya PFA Lining .

Ebikozesebwa ebisookerwako: DuPont PFA resin (USA), ekolebwa mu musomo omuyonjo ogwa kiraasi 10,000 okukakasa obulongoofu obw’amaanyi obw’olupapula lwa lining (adapting to semiconductor-ebyetaago by’omutindo).
Enkola: Rana efulumya mu 9,000㎡ ppb/ppt-level clean workshop era n'etwala "Oyokya-Nyiga okusaanuuka" enkola for integral molding, okwewala obucaafu bw'obutundutundu mu kiseera ky'okufulumya n'okukakasa obuyonjo bwa lining sheet.

Omusingi: Ebifaananyi "Obulongoofu obw'amaanyi + Obuziyiza bw'okukulukuta okw'amaanyi" ebya PFA bigifuula ekintu ekisinga okwettanirwa eky'okukozesa mu kukola ebyuma eby'obulongoofu ebya semikondokita-, okwewala obucaafu bw'ebyuma mu ion y'emikutu (okugeza, electronic-grade hydrogen peroxide) n'okukakasa amakungula g'ebintu ebiva wansi.
Ebirungi: Ebikakasiddwa SMIC, ebirungo bya ion y’ekyuma biba bitono oba byenkana 0.05ppb oluvannyuma lw’okutereka eby’obusannyalazo-grade hydrogen peroxide (amakolero omutindo 0.1ppb), nga ebbugumu liva ku -200℃okutuuka ku 260℃. Nga mmemba w’ekibiina ekigatta amakolero ekya China Semiconductor Industry Association, ekintu kino kiyise mu satifikeeti enkakali okuva mu SMIC, BOE n’ebitongole ebirala.

Enkola z’okukozesa: ezikozesebwa mu semiconductor high-ebyuma ebilongoofu (okugeza, electronic-Ttanka ezitereka asidi wa hydrofluoric grade) n’ebyuma ebitaliimu buwuka (okugeza, ttanka ezitereka ekirungo ekikola ebiramu) nga kyetaagisa obulongoofu obw’amaanyi n’obuyonjo obw’amaanyi. Kiyambye bakasitoma okulongoosa amakungula ga chip (okugeza, wafer y’amakungula wa yinsi 12 okweyongera ebitundu 2%) n’okukendeeza ku kufiirwa kw’ebintu ebiva ku bucaafu.

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